Processes
4
4.1 Introduction
This chapter discusses, in brief, few important processes relevant to the Busbar Systems comprising:
Welding
Jointing
Plating
Painting
Coating
Galvanizing
The table below lists the main purpose of subjecting different components of the Busbar System to the above processes
Table – 4.1
| Process | ||||||
|---|---|---|---|---|---|---|
| Type | Conductor | Enclosure | Structure | |||
| Welding | Cu-Cu Al-Al |
C & S | Al-Al Fe-Fe |
C & S | Al-Al Fe-Fe |
S |
| Jointing | Cu-Cu Al-Al Cu-Al |
C & S | Al-Al Fe-Fe |
C & S | Al-Al Fe-Fe |
S |
| Plating | Ag/Sn/Ni on Cu/Al |
C & P | X | X | Fe | P |
| Painting | Cu Al |
E & P | Al Fe |
E & P | Al Fe |
P |
| Coating | Cu & Al | E, P & I | X | X | X | X |
| Galvanizing | Fe | P | Fe | P | Fe | P |
C – Conductivity E – Emissivity I – Insulation P – Protection S – Strength
(Protection – corrosion, erosion, rain & u/v radiation)
Ag -Silver, Cu– Copper, Sn – Tin, Al – Aluminium, Fe – Steel
The processes are carried out on the surfaces of conductors, enclosures, and support structures.
(Protection – corrosion, erosion, rain & u/v radiation)
Ag -Silver, Cu– Copper, Sn – Tin, Al – Aluminium, Fe – Steel
The processes are carried out on the surfaces of conductors, enclosures, and support structures.