Processes
4
4.1 Introduction
This chapter discusses, in brief, few important processes relevant to the Busbar Systems comprising:
Welding | Jointing | Plating |
Painting | Coating | Galvanizing |
The table below lists the main purpose of subjecting different components of the Busbar System to the above processes
Table – 4.1
Process |
||||||
Type |
Conductor |
Enclosure |
Structure |
|||
Welding |
Cu-Cu |
C & S |
Al-Al |
C & S |
Al-Al |
S |
Al-Al |
Fe-Fe |
Fe-Fe |
||||
Jointing |
Cu-Cu |
C & S |
Al-Al |
C & S |
Al-Al |
S |
Al-Al |
Fe-Fe |
Fe-Fe |
||||
Cu-Al |
|
|
||||
Plating |
Ag/Sn/Ni |
C & P |
X |
X |
Fe |
P |
on Cu/Al |
||||||
Painting |
Cu |
E & P |
Al |
E & P |
Al |
P |
Al |
Fe |
Fe |
||||
Coating |
Cu & Al |
E, P & I |
X |
X |
X |
X |
Galvanizing |
Fe |
P |
Fe |
P |
Fe |
P |
C – Conductivity E – Emissivity I – Insulation P – Protection S – Strength
(Protection – corrosion, erosion, rain & u/v radiation)
Ag -Silver, Cu– Copper, Sn – Tin, Al – Aluminium, Fe – Steel
The processes are carried out on the surfaces of conductors, enclosures, and support structures.