Processes

4

4.1 Introduction

This chapter discusses, in brief, few important processes relevant to the Busbar Systems comprising:

Welding Jointing Plating
Painting Coating Galvanizing

The table below lists the main purpose of subjecting different components of the Busbar System to the above processes

Table – 4.1

Process

Type

Conductor

Enclosure

Structure

Welding

Cu-Cu

C & S

Al-Al

C & S

Al-Al

S

Al-Al

Fe-Fe

Fe-Fe

Jointing

Cu-Cu

C & S

Al-Al

C & S

Al-Al

S

Al-Al

Fe-Fe

Fe-Fe

Cu-Al

Plating

Ag/Sn/Ni

C & P

X

X

Fe

P

on Cu/Al

Painting

Cu

E & P

Al

E & P

Al

P

Al

Fe

Fe

Coating

Cu & Al

E, P & I

X

X

X

X

Galvanizing

Fe

P

Fe

P

Fe

P

– Conductivity       – Emissivity      – Insulation      – Protection      – Strength

(Protection – corrosion, erosion, rain & u/v radiation)

Ag -Silver,   Cu– Copper,   Sn – Tin,   Al – Aluminium,    Fe – Steel

The processes are carried out on the surfaces of conductors, enclosures, and support structures.

(For further reading refer “An Introduction to Busbar Systems” authored by V. Balachandran)